PACKAGE CARRIER AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a package carrier exhibiting excellent heat dissipation effect suitable for mounting a heat generation element, and to provide a method of manufacturing a package carrier.SOLUTION: A substrate including a first metal layer 110, a second metal layer 120 having a top face and a bottom face facing each other, and an insulation layer 130 between the first and second metal layers is provided by a method of manufacturing a package carrier. The second metal layer 120 has a thickness greater than the first metal layer 110. A first opening S1 is formed to penetrate the first metal layer 110 and the insulation layer 130 and to expose a part of the top face of the second metal layer 120. The first metal layer 110 is patterned and a patterned conductive layer 110' is formed. A second opening S2 is formed in the bottom face 124 of the second metal layer 120. The second metal layer 120 is divided into a plurality of heat transfer blocks 120' by the second opening S2 not communicating with the first opening S1.