COATING PROCESSING APPARATUS, COATING PROCESSING METHOD, AND STORAGE MEDIUM

PROBLEM TO BE SOLVED: To provide a technology capable of uniformly forming a coating film in the surface of a substrate.SOLUTION: A coating processing method comprises: supplying a coating liquid for forming a coating film in the central part of a substrate from a nozzle on the surface of the substr...

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Bibliographische Detailangaben
Hauptverfasser:	OTSUKA TAKAHISA, TACHIBANA KOZO, NISHIYA KEN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technology capable of uniformly forming a coating film in the surface of a substrate.SOLUTION: A coating processing method comprises: supplying a coating liquid for forming a coating film in the central part of a substrate from a nozzle on the surface of the substrate; rotating the substrate at a first rotational speed and spreading the coating liquid to the peripheral edge part of the substrate by centrifugal force; raising a liquid film on a central part side of the substrate compared with a liquid film on a peripheral edge part side thereof while maintaining the supply of the coating liquid; shifting a supply position of the coating liquid from the center position of the substrate toward the eccentric position in a state of rotating the substrate at a second rotational speed slower than the first rotational speed in order to form a liquid pool; and stopping the supply of the coating liquid from the nozzle to the eccentric position in a state of slowing down the rotational speed of the substrate to a third rotational speed slower than the second rotational speed in order to increase a thickness of the liquid pool and fit a droplet dripping into the liquid pool at the time of the liquid outage from the nozzle.