SURFACE INSPECTION METHOD AND SURFACE INSPECTION DEVICE
PROBLEM TO BE SOLVED: To provide a surface inspection method that improves measurement precision of a line width of a repeated pattern.SOLUTION: A surface inspection method includes: an irradiation step (S102) for irradiating a wafer surface having a prescribed repeated pattern with linearly polariz...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a surface inspection method that improves measurement precision of a line width of a repeated pattern.SOLUTION: A surface inspection method includes: an irradiation step (S102) for irradiating a wafer surface having a prescribed repeated pattern with linearly polarized light; a light receiving step (S103) for receiving reflected light from the wafer surface irradiated with the linearly polarized light; a detection step (S104) for detecting a polarization component perpendicular to a polarization direction of the linearly polarized light in the reflected light, on a conjugate surface to a pupil surface of an objective lense; and a calculation step (S105) for obtaining a line width of the repeated pattern from a gradation value of the detected polarization component. In the calculation step, the line width of the repeated pattern is obtained from the gradation value at a position in a pupil on a diagonal line and at a position in a pupil off the diagonal line on the pupil surface. |
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