SUBSTRATE TRANSFER APPARATUS FOR BONDING

PROBLEM TO BE SOLVED: To provide an apparatus which is used for transferring substrates fron one position to another position.SOLUTION: A bonding apparatus for performing bonding on each substrate includes a first substrate holding device 18 for clamping a first substrate during bonding and a second...

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Bibliographische Detailangaben
Hauptverfasser:	CHUN WAI KWAN, LAM WING FAI, MAN CHUNG NG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus which is used for transferring substrates fron one position to another position.SOLUTION: A bonding apparatus for performing bonding on each substrate includes a first substrate holding device 18 for clamping a first substrate during bonding and a second substrate holding device 20 for clamping a second substrate during the bonding. A first actuator operates so as to drive the first substrate holding device 18 along a first supply path from an on-loading position thereof to a bonding position thereof, and along a first feedback path from an off-loading position thereof to the on-loading position. A second actuator operates so as to drive the second substrate holding device 20 along a second supply path from an on-loading position thereof to a bonding position thereof, and along a second feedback path from an off-loading position thereof to the on-loading position.