ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method that implement a reliable operation of loading a new tape onto a feeder upon component exhaustion when, for example, a model of printed boards is changed and a component supply app...

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Bibliographische Detailangaben
Hauptverfasser:	ONISHI SEIJI, OYAMA KAZUYOSHI, MATSUYOSHI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and an electronic component mounting method that implement a reliable operation of loading a new tape onto a feeder upon component exhaustion when, for example, a model of printed boards is changed and a component supply apparatus is replaced, or implement a high operation rate by shortening a setup time.SOLUTION: The electronic component mounting apparatus or electronic component mounting method for feeding a supply tape storing electronic components in a plurality of storage portions lined at predetermined intervals to sequentially move the storage portions to a component pickup port for electronic component pickup, picking up the electronic components through the component pickup port, and mounting them on printed boards employs a height measurement sensor for measuring an internal height of the storage portions moved to the component pickup port. Additionally, the supply tape is cued according to the result of measurement.