FILM-FORMING APPARATUS

PROBLEM TO BE SOLVED: To provide a film-forming apparatus which is extremely useful and can be applied even to large substrates of the fourth and higher-order generations.SOLUTION: The film-forming apparatus includes a film-forming chamber 1 in which a film is formed on a substrate 2 held in an upright state by adhering a film-forming material through a mask 3. The film-forming chamber 1 comprises: an alignment drive mechanism, which aligns the mask 3 and the substrate 2 with each other, such that the mask 3 is at a correct position with respect to the substrate 2; an evaporation source 100, which can move in the transfer direction of the substrate 2 or the mask 3; and a mask transfer mechanism and a substrate transfer mechanism, which respectively transfer the substrate 2 and the mask 3 in the upright state to each of a plurality of film-forming positions facing the evaporation source 100. The film-forming apparatus is configured such that the mask 3 and the substrate 2 are aligned with each other at one film-forming position by means of the alignment drive mechanism, while performing film formation at other film-forming position by means of the evaporation source 100.