CONDUCTOR FOIL LAMINATE, PRINTED CIRCUIT BOARD, AND MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a conductor foil laminate, capable of manufacturing a printed circuit board, which satisfactorily reduces a transmission loss particularly in a high-frequency band, which has superior heat resistance, and which satisfactorily suppresses delamination.SOLUTION: The con...

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Hauptverfasser:	MIZUNO YASUYUKI, DANSEIGEN KAZUTOSHI, MASUDA KATSUYUKI, MURAI AKIRA, FUJIMOTO DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductor foil laminate, capable of manufacturing a printed circuit board, which satisfactorily reduces a transmission loss particularly in a high-frequency band, which has superior heat resistance, and which satisfactorily suppresses delamination.SOLUTION: The conductor foil laminate 1 is made of a hardened material of a resin composition comprising an insulation layer 2, a conductor layer 6 disposed while facing the insulation layer 2, and an adhesive layer 4 held between the insulation layer 2 and the conductor layer 6. The adhesive layer 4 contains (A) component; a multifunctional epoxy resin, (B) a component; a multifunctional phenol resin, and (C) a component; a polyamide resin.