HIGH HEAT RADIATION BOARD BASED ON ELECTRO-DEPOSITION COATING AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a high heat radiation board and a method of manufacturing the same.SOLUTION: The method includes: preparing a metal core 100; forming a first insulating layer 200 on the metal core 100 by anodizing, forming a second insulating layer 300 on the metal core 100, on whic...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HO CHOL-HO, SIN SANG-HYUN, YI YONG-KI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high heat radiation board and a method of manufacturing the same.SOLUTION: The method includes: preparing a metal core 100; forming a first insulating layer 200 on the metal core 100 by anodizing, forming a second insulating layer 300 on the metal core 100, on which the first insulating layer 200 is formed, by the electro-deposition coating, and forming a circuit layer 400.