SEMICONDUCTOR-SEALING MATERIAL AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor-sealing material having a proper viscosity, and providing a cured product having a small linear thermal expansion coefficient, and to provide a semiconductor device sealed by using the semiconductor-sealing material.SOLUTION: The semiconductor-sealing...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ENDO MITSUTERU, KONISHI YUICHIRO, MATSUBARA TETSUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor-sealing material having a proper viscosity, and providing a cured product having a small linear thermal expansion coefficient, and to provide a semiconductor device sealed by using the semiconductor-sealing material.SOLUTION: The semiconductor-sealing material contains an alicyclic epoxy compound A solid at 25°C, and having ≤1,000 of a molecular weight and two or more epoxy groups condensed with the ring, an alicyclic epoxy compound B liquid at 25°C, and having ≤1,000 of a molecular weight and two or more epoxy groups condensed with the ring, a curing agent liquid at 25°C, a curing accelerator and silica, regulated so that the ratio (alicyclic epoxy compound B/alicyclic epoxy compound A) of the content of the alicyclic epoxy compound B to the content of the alicyclic epoxy compound A by weight may be 0.5-2. The semiconductor device is sealed by using the semiconductor-sealing material.