CHAMBER, VACUUM PROCESSING APPARATUS, SUBSTRATE TRANSFER METHOD

PROBLEM TO BE SOLVED: To provide a load chamber in which throughput can be enhanced while reducing the cost.SOLUTION: A load chamber LL1 having a sub-chamber 42 can form an airtight space at the top in the sub-chamber 42 by using a substrate cassette base 47 as a partition when the substrate cassette base 47, moving vertically in the sub-chamber 42 and mounting a substrate cassette 5L, is at a raised position, and can transfer a substrate from the substrate cassette 5L to a carrier device when the substrate cassette base 47 is at a lowered position. Since a GV for discharging a substrate supplemented in the sub-chamber 42 to the carrier device side is not required, the number of components can be reduced. Furthermore, since a space requiring exhaustion and ventilation when a substrate 13 is supplemented to the substrate cassette 5L is limited, the throughput can be enhanced.