COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method which enable a pin insertion type component to be mounted on a substrate in shorter time thereby to improve productivity of a mounting board.SOLUTION: With imaging a component 3 sucked by a suction nozzle...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAHARA MASAO, SUMI HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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