COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method which enable a pin insertion type component to be mounted on a substrate in shorter time thereby to improve productivity of a mounting board.SOLUTION: With imaging a component 3 sucked by a suction nozzle...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAHARA MASAO, SUMI HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method which enable a pin insertion type component to be mounted on a substrate in shorter time thereby to improve productivity of a mounting board.SOLUTION: With imaging a component 3 sucked by a suction nozzle 7a from below, a component mounting apparatus images a component mounting region 2a on a substrate 2 from above to specify a plurality of insertion pins P from among a plurality insertion pins P provided with the component 3 based on an obtained image of the component 3. At the same time, the component mounting apparatus specifies a plurality of pin holes H corresponding to the respective specified plurality of insertion pins P based on an obtained image of the component mounting region 2a. The component mounting apparatus calculates each position of the insertion pins P and pin holes H to calculate a transferring amount of the suction nozzle 7a necessary to locate the specified insertion pins P immediately above the corresponding pin holes H and transfers the suction nozzle 7a to align the component 3 and the substrate 2.