SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To prevent a short circuit between elements arranged adjacent to each other across an element isolation region by embedding a microfabricated trench used for the element isolation region with an insulation film without generating voids thereby to inhibit deterioration in manufa...

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Bibliographische Detailangaben
1. Verfasser: NISHITANI JUNICHIRO
Format: Patent
Sprache:eng
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