SYSTEM AND METHOD FOR THERMALLY CUTTING PLATE-SHAPED MATERIAL

PROBLEM TO BE SOLVED: To provide a system and method for thermally cutting a plate-shaped material capable of reducing labor and time for removing slag after thermal cut, improving processing accuracy at a thermal-cut starting point and a thermal-cut end point in groove cutting processing and respon...

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Bibliographische Detailangaben
Hauptverfasser: SUGAWARA YOSHINORI, NAKAMURA SEIICHIRO, TAMAKI NOBUAKI, TAKEUCHI YUGO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a system and method for thermally cutting a plate-shaped material capable of reducing labor and time for removing slag after thermal cut, improving processing accuracy at a thermal-cut starting point and a thermal-cut end point in groove cutting processing and responding to bending and warping of the plate-shaped material to be thermally cut.SOLUTION: The system for thermally cutting the plate-shaped material include: a gas thermal-cut unit (2) having a gas torch; a plasma thermal-cut unit (groove cutting unit 3) having a plasma torch (31); a measuring device (sensor 5) detecting positions (position in the X direction, position in the Z direction) to be thermally cut in the plate-shaped material (W); an adjusting device (e.g. multi-axial robot 6) adjusting positions (position in the X direction, position in the Z direction) of the plasma torch (31) and an inclination angle with respect to a vertical axis; and a control device (10).