WAFER TRANSFER ARM AND WAFER TRANSFER APPARATUS

PROBLEM TO BE SOLVED: To provide a wafer transfer arm and wafer transfer apparatus, capable of facilitating removal of a wafer from a wafer suction section after sucking a wafer under vacuum and completing predetermined wafer transfer.SOLUTION: The wafer transfer arm includes a wafer suction section...

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1. Verfasser: IKEDA SEIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wafer transfer arm and wafer transfer apparatus, capable of facilitating removal of a wafer from a wafer suction section after sucking a wafer under vacuum and completing predetermined wafer transfer.SOLUTION: The wafer transfer arm includes a wafer suction section that is formed from a non-elastic body and has an opening and a support section that is connected with the wafer suction section and has an intake passage communicating with the opening.