THERMALLY CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE MADE OF THE SAME

PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition excellent in flexibility, impact resistance and the like as well as in heat resistance and resistance to moist heat.SOLUTION: The thermally conductive resin composition includes copolymerized polyester resin A and thermally co...

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Hauptverfasser:	ITO AKIRA, FURUKAWA MIKIO, OKOCHI TAKAO, TOMIZAWA MOTOTAKA, MASAI YUYA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition excellent in flexibility, impact resistance and the like as well as in heat resistance and resistance to moist heat.SOLUTION: The thermally conductive resin composition includes copolymerized polyester resin A and thermally conductive filler B. The capacity ratio A/B between A and B ranges from 30/70 to 90/10, and A contains aromatic dicarboxylic acid and dimer acid as acid components and contains 1,4-butanediols and polybutadiene glycols as glycol components. The content of the dimer acid in the acid components ranges from 10 to 50 mol%, the content of 1,4-butanediols in the glycol components is not less than 80 mol%, and the content of polybutadiene glycols in the glycol components ranges from 1 to 20 mol%.