SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing stress due to thermal shrinkage.SOLUTION: A semiconductor device comprises: a multilayer substrate 2; a semiconductor chip 1 disposed on the multilayer substrate 2; a plurality of metal bumps 4 connecting the multilayer subs...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing stress due to thermal shrinkage.SOLUTION: A semiconductor device comprises: a multilayer substrate 2; a semiconductor chip 1 disposed on the multilayer substrate 2; a plurality of metal bumps 4 connecting the multilayer substrate 2 and the semiconductor chip 1; and a sealing resin layer 10 that is provided between the semiconductor chip 1 and the multilayer substrate 2 and is formed by a sealing resin 3. In the sealing resin layer 10, a plurality of columnar cavities 5 are formed, and the volume of the plurality of cavities 5 is equal to or greater than half of the volume of the sealing resin layer 10. |
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