SUBSTRATE SPLITTING DEVICE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To cut a substrate by more accurate cutting lines.SOLUTION: A substrate splitting control step includes an image processing step in which an image processing system 11 recognizes a virtual cutting line 11a based on the image data of alignment marks at at least two points detected by one detection camera 8, an arithmetic processing step in which an arithmetic processing system 12 calculates the position correction amount of a circuit board 1 as a deviation amount based on the data of the virtual cutting line 11a thus recognized, and a table control step in which an X, Y, axis table control system 13 corrects the position of the circuit board 1 by driving at least a Y table 9B and a axis table 13A based on the position correction data calculated in the arithmetic processing step.