COMPOSITION FOR COPPER FILM FORMING, AND METHOD OF MANUFACTURING COPPER FILM USING THE COMPOSITION

PROBLEM TO BE SOLVED: To provide a solution type composition for forming a copper film, having a favorable coating property, having high preservation stability, convertible into the copper film at low temperatures, and capable of economically manufacturing the copper film that exhibits high conducti...

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Bibliographische Detailangaben
Hauptverfasser:	TOYODA SHOHEI, YOSHINAKA ATSUYA, TAKAGI DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solution type composition for forming a copper film, having a favorable coating property, having high preservation stability, convertible into the copper film at low temperatures, and capable of economically manufacturing the copper film that exhibits high conductivity.SOLUTION: As an essential component, the composition for copper film forming contains 1 mol part of copper formate or hydrate thereof, 0.25-2.0 mol parts of at least one type of diol compound selected from a group consisting of diol compounds expressed either by the general formula (1) or by the general formula (1'), 0.25-2.0 mol parts of piperidine compound expressed by the general formula (2), and an organic solvent dissolving them.