INTEGRATED CIRCUIT MOUNTING SUBSTRATE MODULE

PROBLEM TO BE SOLVED: To provide an integrated circuit mounting substrate module which can be produced compactly and inexpensively as a whole while maintaining good characteristics of a semiconductor integrated circuit.SOLUTION: An MMIC1 is flip-chip mounted on a first substrate 2 via a first connection bump 3 and a first bump pad 4. The first substrate 2 mounting the MMIC1 is flip-chip mounted on a second substrate 6 via a second connection bump 7 and second bump pads 8a, 8b. A recess is provided in the first substrate 2 at a part where the MMIC1 is mounted. The recess has an outer periphery significantly smaller than that of the MMIC1 being mounted. It has such a depth as the outer peripheral surface of the MMIC1 just abuts against the first substrate 2 when the MMIC1 is mounted via the first connection bump 3. In other words, when the MMIC1 is mounted on the first substrate 2, a sealing air gap 5 is formed therebetween.