ELECTROMAGNETIC WAVE SHIELD MATERIAL FOR FPC

PROBLEM TO BE SOLVED: To provide a thin and flexible electromagnetic wave shield material for FPC having excellent flexing characteristics in which the electromagnetic wave shielding performance does not degrade even if severe bending operation is repeated.SOLUTION: In the electromagnetic wave shiel...

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Hauptverfasser:	GOTO NOBUHIRO, KOKUNI MORITOSHI, FUJII SANAE, NOMURA NAOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thin and flexible electromagnetic wave shield material for FPC having excellent flexing characteristics in which the electromagnetic wave shielding performance does not degrade even if severe bending operation is repeated.SOLUTION: In the electromagnetic wave shield material 1 for FPC, a substrate 2 consisting of a dielectric is a flexible polyimide film having a thickness of 3-15 μm, and an adhesive layer 3 and a conductive paste layer 4 are laminated sequentially on one side of the substrate 2. Preferably, the adhesive layer 3 is composed of an adhesive resin composition ensuring an adhesive force of the conductive paste layer 4 to the substrate 2 of 6 N/inch or higher, and having heat resistance of 240-260°C.