METHOD FOR MANUFACTURING MOLTEN SOLDER PLATING WIRE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a molten solder plating wire capable of further reducing an immersion time into a solder plating tank when manufacturing a soft copper wire, and realizing further enhancement of a plating line speed, compared with the case when using oxygen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO TETSUHIRO, KIMOTO KUNIAKI, WASHIMI TORU, AOYAMA MASAYOSHI, SAWAHATA KATSUNORI, OKADA RYOHEI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BASIC ELECTRIC ELEMENTS CABLES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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