METHOD FOR MANUFACTURING MOLTEN SOLDER PLATING WIRE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a molten solder plating wire capable of further reducing an immersion time into a solder plating tank when manufacturing a soft copper wire, and realizing further enhancement of a plating line speed, compared with the case when using oxygen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO TETSUHIRO, KIMOTO KUNIAKI, WASHIMI TORU, AOYAMA MASAYOSHI, SAWAHATA KATSUNORI, OKADA RYOHEI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL BASIC ELECTRIC ELEMENTS CABLES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METALLURGY PERFORMING OPERATIONS PUNCHING METAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a molten solder plating wire capable of further reducing an immersion time into a solder plating tank when manufacturing a soft copper wire, and realizing further enhancement of a plating line speed, compared with the case when using oxygen free copper (OFC).SOLUTION: The method for manufacturing the molten solder plating wire comprises: a step of applying a wire drawing process on a final wire diameter to a thin copper alloy material containing sulfur of 2-12 massppm, oxygen of more than 2 and not more than 30 massppm, and titanium of 4-55 massppm in pure copper containing inevitable impurities, and producing a wire drawing material; and a molten solder plating step of forming a molten solder plating layer on the surface of the wire drawing material by immersing the wire drawing material into the molten solder plating tank. The wire drawing material is altered to a soft copper wire depending on a heating value of the molten solder plating process.