EPOXY RESIN PRECURSOR COMPOSITION, PREPREG, LAMINATED PLATE, RESIN SHEET, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin precursor composition which has a high glass transition temperature and a low coefficient of thermal expansion, suppresses warpage of a printed wiring board in a comprehensive manner when used in the printed wiring board, meets the demand for further t...

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Bibliographische Detailangaben
1. Verfasser:	TOBISAWA AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin precursor composition which has a high glass transition temperature and a low coefficient of thermal expansion, suppresses warpage of a printed wiring board in a comprehensive manner when used in the printed wiring board, meets the demand for further thinning of a printed wiring board, and ensures superior reliability such as insulation reliability when applied to a thin printed wiring board.SOLUTION: The epoxy resin precursor composition comprises a mixture of specific epoxy compounds described in the specification, a bismaleimide compound, an inorganic filler, and a basic organic solvent.