SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances the lead-out performance of wiring, suppresses a possibility of causing electric problems such as a short-circuit between the wiring, and which is intended to save the area where the wiring is formed.SOLUTION: Plural first wiring...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO KOJI, KAMIGAKI TETSUYA, ITO EIJI, KINOSHITA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances the lead-out performance of wiring, suppresses a possibility of causing electric problems such as a short-circuit between the wiring, and which is intended to save the area where the wiring is formed.SOLUTION: Plural first wiring 3 is juxtaposed in a predetermined layer on a substrate 4 provided in the semiconductor device 1. Each of the first wiring 3 is formed, extending long as directing from one side to the other side along a direction of arranging the first wiring 3, or is formed with a reduced condition. Along with that, each of the first wiring 3 is disposed at a position where adjacent one ends 3a thereof are shifted to each other in a direction perpendicular to an arranged direction.