HEAT SINK

HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink that has excellent heat exchange performance and whose manufacturing method is easy, and to provide the manufacturing method therefor.SOLUTION: The heat sink has a substrate, and a plurality of fins 12A, 12B, 12C,...12X, 12Y, 12Z. Tip of the fin 12A... ha...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKASE NOBUYUKI, SUGIMOTO TEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat sink that has excellent heat exchange performance and whose manufacturing method is easy, and to provide the manufacturing method therefor.SOLUTION: The heat sink has a substrate, and a plurality of fins 12A, 12B, 12C,...12X, 12Y, 12Z. Tip of the fin 12A... has a bent part 12b that is bent to touch adjoining fins 12A... side. A substantially hollow part V is formed between fins adjacent to each other. The tips of all fins 12A... are not required to form the bent parts 12b, and the bent parts 12b may be provided partially.