VAPORIZER
PROBLEM TO BE SOLVED: To provide a vaporizer for MOCVD, which can obtain a vaporized gas in which a raw material solution is uniformly dispersed, and to provide a method for vaporizing the raw material solution.SOLUTION: The vaporizer comprises: (1) a distribution part 8 which includes a gas introdu...
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| creator | FUKAGAWA MITSURU YAMAMOTO KOHEI UCHIZAWA OSAMU KANNO YOICHI KUSUHARA MASAKI MEGURO TOSHIKATSU DOI MIKIO TODA MASAYUKI UMEDA MASARU |
| description | PROBLEM TO BE SOLVED: To provide a vaporizer for MOCVD, which can obtain a vaporized gas in which a raw material solution is uniformly dispersed, and to provide a method for vaporizing the raw material solution.SOLUTION: The vaporizer comprises: (1) a distribution part 8 which includes a gas introducing port 4 for introducing a pressurized carrier gas 3 to a gas passage, means for supplying the raw material solution 5a to the gas passage, and a gas outlet 7 for sending the carrier gas containing the raw material solution to a vaporization part 22; and (2) the vaporization part 22 which includes a vaporization tube 20 having one end connected to a reaction tube of an MOCVD device and the other end connected to the gas outlet 7 and heating means for heating the vaporization tube 20, and is used for heating and vaporizing the carrier gas containing the raw material solution sent from the distribution part 8. (3) The distribution part 8 has a main body 1 of the distribution part having a cylindrical hollow part, a rod 10 having an outer diameter smaller than an inner diameter of the cylindrical hollow part, and a spiral groove 60 in the side of the vaporizer 22 in the periphery of the rod 10. The rod 10 is inserted in the cylindrical hollow part. |
| format | Patent |
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(3) The distribution part 8 has a main body 1 of the distribution part having a cylindrical hollow part, a rod 10 having an outer diameter smaller than an inner diameter of the cylindrical hollow part, and a spiral groove 60 in the side of the vaporizer 22 in the periphery of the rod 10. The rod 10 is inserted in the cylindrical hollow part.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120517&DB=EPODOC&CC=JP&NR=2012094907A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120517&DB=EPODOC&CC=JP&NR=2012094907A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKAGAWA MITSURU</creatorcontrib><creatorcontrib>YAMAMOTO KOHEI</creatorcontrib><creatorcontrib>UCHIZAWA OSAMU</creatorcontrib><creatorcontrib>KANNO YOICHI</creatorcontrib><creatorcontrib>KUSUHARA MASAKI</creatorcontrib><creatorcontrib>MEGURO TOSHIKATSU</creatorcontrib><creatorcontrib>DOI MIKIO</creatorcontrib><creatorcontrib>TODA MASAYUKI</creatorcontrib><creatorcontrib>UMEDA MASARU</creatorcontrib><title>VAPORIZER</title><description>PROBLEM TO BE SOLVED: To provide a vaporizer for MOCVD, which can obtain a vaporized gas in which a raw material solution is uniformly dispersed, and to provide a method for vaporizing the raw material solution.SOLUTION: The vaporizer comprises: (1) a distribution part 8 which includes a gas introducing port 4 for introducing a pressurized carrier gas 3 to a gas passage, means for supplying the raw material solution 5a to the gas passage, and a gas outlet 7 for sending the carrier gas containing the raw material solution to a vaporization part 22; and (2) the vaporization part 22 which includes a vaporization tube 20 having one end connected to a reaction tube of an MOCVD device and the other end connected to the gas outlet 7 and heating means for heating the vaporization tube 20, and is used for heating and vaporizing the carrier gas containing the raw material solution sent from the distribution part 8. 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(3) The distribution part 8 has a main body 1 of the distribution part having a cylindrical hollow part, a rod 10 having an outer diameter smaller than an inner diameter of the cylindrical hollow part, and a spiral groove 60 in the side of the vaporizer 22 in the periphery of the rod 10. The rod 10 is inserted in the cylindrical hollow part.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VAPORIZER |
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