PLATE THICKNESS MEASURING DEVICE

PROBLEM TO BE SOLVED: To provide a plate thickness measuring device capable of readily measuring the degrees of corrosion of ground bordering parts of steel pipe pillars.SOLUTION: A plate thickness measuring device 10 comprises a scanner 20 that holds a probe and a controller 30 that controls the sc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FURUTA HISATO, TOTO MASAYA, SUZUKI TOSHIICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plate thickness measuring device capable of readily measuring the degrees of corrosion of ground bordering parts of steel pipe pillars.SOLUTION: A plate thickness measuring device 10 comprises a scanner 20 that holds a probe and a controller 30 that controls the scanner 20; when the scanner 20 is mounted in a desired position on the inner circumference of a cylindrical steel pipe pillar 42, the plate thickness of the steel pipe pillar is measured by using the probe; in order to place the probe held by the scanner 20 in the desired position on the inner circumference of the steel pipe pillar, a probe feeding jig is used; when the probe has been mounted in the desired position by the probe feeding jig, the scanner 20 is shifted along the inner circumference of the steel pipe pillar 42, and data on any defect identified by the probe are transmitted to the controller 30.