SENSOR DEVICE

PROBLEM TO BE SOLVED: To provide a connection between cases with high sealability only by abutment between the cases.SOLUTION: A cover 3 is fitted to a base 1 in which a sensor module 7 is installed and fixed to form a housing 5. The base 1 has a fitting projection 15 provided along an outer periphe...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SHIMAMOTO NOBUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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