SENSOR DEVICE

PROBLEM TO BE SOLVED: To provide a connection between cases with high sealability only by abutment between the cases.SOLUTION: A cover 3 is fitted to a base 1 in which a sensor module 7 is installed and fixed to form a housing 5. The base 1 has a fitting projection 15 provided along an outer periphe...

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Bibliographische Detailangaben
1. Verfasser: SHIMAMOTO NOBUAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connection between cases with high sealability only by abutment between the cases.SOLUTION: A cover 3 is fitted to a base 1 in which a sensor module 7 is installed and fixed to form a housing 5. The base 1 has a fitting projection 15 provided along an outer peripheral edge thereof, and the cover 3 has a fitting groove 23 to which the fitting projection 15 is fitted. A protrusion 21 having a triangular cross-section is preliminarily formed at an end surface of the fitting projection 15. When the cover 3 is fitted to the base 1 to provide a connection between the cover 3 and the base 1, the protrusion 21 of the end surface of the fitting projection 15 is abutted to the bottom of the fitting groove 23, thereby being plastically deformed and crushed to form a seal portion S.