LIGHT EMITTING DIODE (LED) PACKAGE AND METHOD OF FABRICATION

PROBLEM TO BE SOLVED: To provide a light emitting diode (LED) package having domes fabricated using a molding process and method for fabricating the same.SOLUTION: A light emitting diode package 10 comprises: a substrate 12; a light emitting diode die 14 mounted to the substrate; a frame 16 on the s...

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Hauptverfasser:	HAOUN CHENG, YUANXIAO CHEN, CHU CHENFU, FUN JEN KAO, WEN-HUANG LIU, DAN CHUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a light emitting diode (LED) package having domes fabricated using a molding process and method for fabricating the same.SOLUTION: A light emitting diode package 10 comprises: a substrate 12; a light emitting diode die 14 mounted to the substrate; a frame 16 on the substrate configured to surround the light emitting diode die; a wire 18 bonded to the light emitting diode die and to the substrate; and a transparent dome 20 configured as a lens encapsulating the light emitting diode die. A method for fabricating a light emitting diode package comprises the steps of: providing a substrate; forming a frame having surrounding shape on the substrate; attaching at least one light emitting diode die to the substrate surrounded by the surrounding shape; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode die.