DENSE OPC

PROBLEM TO BE SOLVED: To provide a method of calculating process conditions for performing optical correction and process correction (OPC) or other resolution enhancement techniques on a layout design.SOLUTION: Process conditions are estimated on a layout database on a substantially uniform grid. Co...

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Bibliographische Detailangaben
Hauptverfasser:	NICHOLAS B COBB, DRAGOS DUDA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of calculating process conditions for performing optical correction and process correction (OPC) or other resolution enhancement techniques on a layout design.SOLUTION: Process conditions are estimated on a layout database on a substantially uniform grid. Contour S curves are created from the estimated process conditions. The contour curves are then compared against the features in the layout to determine edge placement errors. From the edge placement errors, OPC or other corrections for the features can be made.