ELECTRONIC COMPONENT MATERIAL

PROBLEM TO BE SOLVED: To provide an electronic component material which can be used as a substitute for Cu alloy, has light weight and can reduce raw material cost.SOLUTION: A first plating layer 13 is formed on the surface of a substrate 10 of Al alloy having a tensile strength of 90-700 MPa and a Vickers hardness of 30-230 Hv. The first plating layer 13 is composed of one or more of Ni, Ni alloy, Cu, Cu alloy, Ag, Ag alloy, Sn, Sn alloy, Pd, Pd alloy, Au and Au alloy. The Al alloy substrate 10 contains, for example, 13.0 mass% or less of Si, 1.5 mass% or less of Fe, 6.8 mass% or less of Cu, 1.5 mass% or less of Mn, 5.6 mass% or less of Mg, 0.5 mass% or less of Cr, 8.4 mass% or less of Zn, 0.2 mass% or less of Ti, and inevitable impurities.