PACKAGING METHOD FOR MICROCHIP DEVICE

PROBLEM TO BE SOLVED: To provide a packaging method for a microchip device.SOLUTION: An aperture 11 is formed in a recessed shape on a surface of an interposer 7. A first aperture 15 is formed from the lower part of the recessed part forming the aperture 11 to a rear face opposite from the surface of the interposer 7. A second aperture 16 from the lower part of the recessed part forming the aperture 11 to the rear face opposite from the surface of the interposer 7 is formed on a front side of the first aperture 15 in a packaging direction of an electrical insulation material to the aperture 11. The interposer 7 is arranged in the vicinity of a microchip device 1 so that a first electric contact point is accessible from the surface side of the interposer 7 via the aperture 11 and the first aperture 15 while the second aperture 16 is positioned outside a packaging region.