ALUMINUM ALLOY CLAD MATERIAL

PROBLEM TO BE SOLVED: To provide an aluminum alloy clad material which is high in rigidity while satisfying a soldering property and a melting point.SOLUTION: The aluminum alloy clad material is formed by cladding a sacrificial material 3 on one face of a core material 2 and a soldering material 4 o...

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Bibliographische Detailangaben
Hauptverfasser: YOSHINO MICHIHIDE, KURODA SHU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an aluminum alloy clad material which is high in rigidity while satisfying a soldering property and a melting point.SOLUTION: The aluminum alloy clad material is formed by cladding a sacrificial material 3 on one face of a core material 2 and a soldering material 4 on the other face. The sacrificial material 3 contains 4.1 to 7.5 mass% of Zn, 1.2 to 2.5 mass% of Mg, and 0.1 to 0.4 mass% of Si, and its remaining part is composed of Al and inevitable impurities. The core material 2 contains 1.0 to 1.8 mass% of Mn, 0.5 to 1.2 mass% of Si, 0.1 to 0.4 mass% of Fe, and 0.5 to 1.5 mass% of Cu, and its remaining part is composed of Ai and inevitable impurities. Furthermore, an average crystal particular diameter of the core material 2 after being soldered is within a range of 30 to 200 μm.