CONDUCTION COOLED PACKAGE LASER AND METHOD FOR PACKAGING THE SAME

CONDUCTION COOLED PACKAGE LASER AND METHOD FOR PACKAGING THE SAME

PROBLEM TO BE SOLVED: To provide a method for packaging a conduction cooled package laser which reduces influence caused by high heat in a manufacturing process to semiconductor laser characteristics, and reduces embrittlement and fracture caused by a semiconductor laser.SOLUTION: In the packaging m...

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Bibliographische Detailangaben
Hauptverfasser: YANG HUI-PING, SEO YEONG-PUNG, HSIEH CHIA-HUNG, SHO HAKUBUN, O SHISON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for packaging a conduction cooled package laser which reduces influence caused by high heat in a manufacturing process to semiconductor laser characteristics, and reduces embrittlement and fracture caused by a semiconductor laser.SOLUTION: In the packaging method and the structure of the conduction cooled package laser 200, the method includes a step of welding a semiconductor laser element 210 to a first heat spreader 230, and a step of fixing the first heat spreader 230 to a second heat spreader 250 with an aluminum-nickel multilayer thin film composite material 240.