HEAT DISSIPATION STRUCTURE

HEAT DISSIPATION STRUCTURE

PROBLEM TO BE SOLVED: To obtain a lightweight heat dissipation structure having a high heat dissipation performance.SOLUTION: The heat dissipation structure consists of a thermal conductive resin composition having a specific gravity of 1.0-2.0 and is disposed to come into contact with a heating ele...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ONOE SHUHEI, KIN TATSUICHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a lightweight heat dissipation structure having a high heat dissipation performance.SOLUTION: The heat dissipation structure consists of a thermal conductive resin composition having a specific gravity of 1.0-2.0 and is disposed to come into contact with a heating element at least partially. A contact area S1 of the heating element and the heat dissipation structure is 1-10 cmfor the heating value of 1 W from the heating element. Out of the surface area of the heat dissipation structure for the heating value of 1 W from the heating element, a contact area S2 with the outside air is 10-50 cm.