METHOD FOR INSPECTING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In a flatness inspection of BGA (a semiconductor device), a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (-) is formed. With use of the flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective, so that defective mounting caused by a package warp when heated during reflow mounting and the like is reduced and the reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.