SOUND INSULATION FLOOR COMPONENT AND SOUND INSULATION FLOOR STRUCTURE

PROBLEM TO BE SOLVED: To provide a sound insulation floor structure which can restrain a flooring material from sinking due to walking, which can provide a good feeling of walking, and which exerts high sound insulation performance against a floor impact sound.SOLUTION: A sound insulation floor comp...

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Bibliographische Detailangaben
Hauptverfasser:	ADACHI ATSUMI, TAKAMATSU MASAHIKO, KOIZUMI SATOSHI, KOIKE TAKERU, KINDEI HIDENORI, MIYAIE NOBORU, KIYOOKA SUMITO
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS ROOFS WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sound insulation floor structure which can restrain a flooring material from sinking due to walking, which can provide a good feeling of walking, and which exerts high sound insulation performance against a floor impact sound.SOLUTION: A sound insulation floor component 10 comprises a rigid layer 15, floor joists 13 which are disposed in parallel at an interval on one surface of the rigid layer 15, and compressed layers 14 which are disposed adjacently to the floor joists 13 in such a manner that the compressed layer and the floor joist alternate with each other and which are thicker than the floor joists. A sound insulation floor structure may also be formed by interposing the sound insulation floor component 10 between a sub-floor material and a floor finishing layer. In the sound insulation floor structure, the compressed layer 14 is compressed up to the thickness of the floor joist. The compressed layer 14 may also be formed of a nonwoven fiber structure with a thickness of 3-60 mm and an apparent density of 0.03-0.2 g/cm.