HOUSING OF PORTABLE DEVICE

PROBLEM TO BE SOLVED: To provide a housing of a portable device which is suitable for reducing the thickness and the size by improving a switch part housing structure of the portable device.SOLUTION: A box shaped metal structure is molded by press working or the like, and a resin external body 200 i...

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Bibliographische Detailangaben
1. Verfasser:	KOKATSU TOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a housing of a portable device which is suitable for reducing the thickness and the size by improving a switch part housing structure of the portable device.SOLUTION: A box shaped metal structure is molded by press working or the like, and a resin external body 200 is integrally formed therewith by injection-molding resin around the metal structure 100. A flexible substrate 300, which serves as a key switch, is disposed on a switch receiving surface 101 of the metal structure 100. The resin external body 200 is not bonded to the box shaped metal structure 100. However, the resin fills in connection holes of the metal structure 100, and thus the resin external body 200 is not separated from the box shaped metal structure 100 after the molding. Hence, the housing of the portable device, which is suitable for reducing the thickness and the size, is obtained.