METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MASK

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that distributes layout patterns so as to be able to prevent a factor of reduction in yield.SOLUTION: A method of manufacturing a semiconductor device using double patterning comprises the steps of: preparing a plurali...

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Bibliographische Detailangaben
Hauptverfasser:	TAOKA HIRONOBU, SHIGENIWA AKEMI, SAKAI JUNJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that distributes layout patterns so as to be able to prevent a factor of reduction in yield.SOLUTION: A method of manufacturing a semiconductor device using double patterning comprises the steps of: preparing a plurality of masks used for the double patterning; and performing the double patterning using the plurality of masks. The step of preparing the plurality of masks includes the step of distributing a layout pattern group LPG1 into the plurality of masks in consideration of sizes of layout patterns LP1 to LP4 according to the property of the exposure process using each of plurality of masks.