TECHNIQUE FOR EVALUATING FABRICATION OF SEMICONDUCTOR COMPONENT AND WAFER

PROBLEM TO BE SOLVED: To provide a mechanism for analyzing fabrication of a wafer.SOLUTION: The fabrication of the wafer can be analyzed starting from when the wafer is in a partially fabricated state. The value of a specific performance parameter can be determined at a plurality of locations on an active area of a die of the wafer. The specific performance parameter is known to be indicative of a particular fabrication process in the fabrication. At this time, evaluation information can be obtained based on variations of the performance parameter value 106 at the plurality of locations. This can be performed without affecting a usability of a chip that is created from the die. Evaluation information 107 can be used to evaluate how one or more processes including the particular fabrication process indicated by the performance parameter value 106 have been performed.