HYBRID CORE SUBSTRATE AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, AND BUILD-UP SUBSTRATE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a hybrid core substrate which minimizes warpage of the substrate due to thermal history such as reflow when a semiconductor integrated circuit is packaged, and to provide a semiconductor integrated circuit package using it, and a build-up substrate.SOLUTION: A plurality of ceramic substrates 302 having the substantially same size as that of a semiconductor chip to be packaged are fitted to a core substrate having a plurality of openings, and then an insulation layer 303 having an elasticity modulus lower than that of the core substrate is laminated on the surface layer of the ceramic substrate thus producing a hybrid core substrate. Even if the substrate is used in packaging of a semiconductor chip by solder joining, warpage of the substrate can be minimized and a build-up substrate exhibiting good workability can be obtained.