MINUTE SAMPLE PROCESSING OBSERVATION METHOD AND DEVICE THEREOF

PROBLEM TO BE SOLVED: To provide a minute sample processing observation device and a minute sample processing observation method that carry out observation and analysis of a sectional face of a wafer from horizontal to vertical directions without breaking the wafer to be a sample with higher resolut...

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Bibliographische Detailangaben
Hauptverfasser: TOKUDA MITSUO, SHICHI HIROYASU, FUKUDA MUNEYUKI, TOMIMATSU SATOSHI, KOIKE HIDEMI, MITSUI YASUHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a minute sample processing observation device and a minute sample processing observation method that carry out observation and analysis of a sectional face of a wafer from horizontal to vertical directions without breaking the wafer to be a sample with higher resolution, higher accuracy, and higher throughput.SOLUTION: The minute sample processing observation device includes a focused ion beam optical system 31 and an electron beam optical system 41 in an identical vacuum device, and a probe 72 that separates a minute sample containing a desired area of the wafer 21 by a charged particle beam type molding process and takes out the separated minute sample.