SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method therefor, improving the yield of wiring connectivity formed on a semiconductor element, without requiring high accuracy when mounting the semiconductor element on a support plate.SOLUTION: The semiconductor device includes: the support plate; the semiconductor element mounted on the support plate and including a circuit element plane having a plurality of first electrodes formed thereon; a first insulation layer, having a plurality of first openings exposing the plurality of first electrodes, for covering the circuit element plane of the semiconductor element; a second insulation layer covering the upper portion of the support plate and the side face of the semiconductor element having the formed first insulation layer; and a wiring layer formed in contact to the upper portion of the first insulation layer and the second insulation layer and electrically connected to the plurality of first electrodes. According to the semiconductor device manufacturing method, the yield of wiring connectivity is improved by the reduction of the warp of the support plate caused by thermal stress, and it is possible to manufacture the semiconductor device which does not require high mount accuracy of the semiconductor element required at opening formation.