METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board in which the distance between projections is reduced to increase wettability of underfill resin with a solder resist layer and to reduce the manufacturing cost.SOLUTION: A method for manufacturing a printed wiring board includes: providing a plurality of salient 22 with a spacing therebetween on one surface 21a of a mask film 21 in a direction parallel to the one surface; forming a mask pattern 23 on the mask film; carrying out mold release treatment on the one surface of the mask film; placing solder resist agent 3A on a substrate 2; placing the mask film on the solder resist agent with the one surface facing the solder resist agent; exposing the solder resist agent to form a solder resist layer 3 on which a plurality of salient conforming to a plurality of the salient on the mask film are formed; and removing the mask film from the solder resist layer.