MANUFACTURING METHOD OF STEM FOR SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To improve manufacturing yield of a stem for a semiconductor package.SOLUTION: An antioxidation film 20 (nickel plating film), which prevents the oxidation of an eyelet 11, is formed on the eyelet 11 by performing plating treatment. Subsequently, a diffusion prevention film 21...

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Bibliographische Detailangaben
Hauptverfasser:	AOKI TOSHIYUKI, HAYASHI EISHIN, JINTSUGAWA IZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve manufacturing yield of a stem for a semiconductor package.SOLUTION: An antioxidation film 20 (nickel plating film), which prevents the oxidation of an eyelet 11, is formed on the eyelet 11 by performing plating treatment. Subsequently, a diffusion prevention film 21 (iron plating film), which prevents the diffusion to a brazing material 16, is formed on the antioxidation film 20 by performing plating treatment. Then, after the brazing material 16 is placed on the diffusion prevention film 21, the brazing material 16 is melted by performing heat treatment to join the eyelet 11 with a heat sink 12.