PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING RIB PATTERN, METHOD FOR FORMING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moist-heat resistance and showing, in a cured product of the composition, a high elastic modulus at a high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a metho...

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Bibliographische Detailangaben
1. Verfasser:	KATO SADAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent moist-heat resistance and showing, in a cured product of the composition, a high elastic modulus at a high temperature and excellent hollow structure retaining property, and to provide a photosensitive film, a method for forming a rib pattern, a method for forming a hollow structure, and electronic components using the composition.SOLUTION: The photosensitive resin composition to be used as a rib material or a cap material for forming a hollow structure in an electronic component having the hollow structure contains inorganic filler having an average aspect ratio of 30 to 100, preferably over 50 and 100 or less, and having a volume average particle diameter of 5 to 50 μm. The photosensitive film is obtained from the photosensitive resin composition.