PRESSURE SENSOR

PROBLEM TO BE SOLVED: To provide a pressure sensor in which a semiconductor pressure sensor is housed and of which outside is covered with a covering, and which has a simplified structure with high airtightness maintained.SOLUTION: In a pressure sensor, the inside of a cover 60 is divided by a press...

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Bibliographische Detailangaben
Hauptverfasser: AOYAMA TSUNEHISA, TAKATSUKI OSAMU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a pressure sensor in which a semiconductor pressure sensor is housed and of which outside is covered with a covering, and which has a simplified structure with high airtightness maintained.SOLUTION: In a pressure sensor, the inside of a cover 60 is divided by a pressure detecting part 110 to thus form a first space 51. The first space 51 in which a lead pin 43 and a lead wire 47 of a semiconductor pressure-detecting element 41 are housed is enclosed by a first adhesive 71. Therefore, liquid such as external moisture can be prohibited from penetrating into the first space 51. Also, a second space 52 formed between the side of a receiving member 2, which is a flow tube connection member of the pressure detecting part 110, and the cover 60 is enclosed by an adhesive. The liquid such as moisture which may penetrate from the side of the pressure detecting part 110 of the cover 60 through the second space 52 is prohibited by the second adhesive 72 enclosing the second space 52.