RESIN MOLDING MATERIAL FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE AND RESIN MOLDING

PROBLEM TO BE SOLVED: To provide a resin molding material for an optical semiconductor light-emitting device having high heat conductivity and high optical reflectance of wavelength in a near ultraviolet region, and provide a resin molding for the optical semiconductor light-emitting device having h...

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Bibliographische Detailangaben
Hauptverfasser:	MORI HIROSHI, HARAGUCHI YUKIYA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin molding material for an optical semiconductor light-emitting device having high heat conductivity and high optical reflectance of wavelength in a near ultraviolet region, and provide a resin molding for the optical semiconductor light-emitting device having high moldability in the molding.SOLUTION: In a resin molding material for a semiconductor light-emitting device, (A) polyorganosiloxane, (B) inorganic filler, and (C) curing catalyst are included, and boron nitride or aluminium nitride having the primary particle diameter of not less than 0.1 μm but not more than 7.0 μm is included as the (B) inorganic filler.